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GRAND BOND Electronics Ltd.
宏 邦 電 子 有 限 公 司
MANUFACTURING PROCESS
(1) SMT Pick & Place and IR Re-flow Soldering Process
(2) Manual Insertion Process
(3) COB Process
(4) Wave Soldering and Automatic soldering Process
(5) Pre-test and Inspection Process
AOI Inspection
In Circuit Testing
(6) In-Circuit Programming Process
(7) Functional Test Process
(8) Ultra-Sonic Cleaning Process
(9) Expoxy Potting , Conformal Coating Process
(10) Reliability Test Process (Burn In)
(11) Packaging Process
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