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GRAND BOND Electronics Ltd.
宏 邦 電 子 有 限 公 司
(1) SMT Production Facilities 1
6 SMT Production lines
Japan brand pick and place can place any SMT componets size up to BGA
(2) SMT Production Facilities 2
Automatic Solder Paste Printer
Stencil Printer
(3) SMT Production Facilities 3
Automatic Board Loader
IR Reflow Oven
(4) Manual Insertion & Conveyor Belt Assembly lines
(5) COB Bonding and dust proof facilities
Bonding production line
Automatic Die attached Machine
Fully Automatic Wire Bonding Machine
Automatic Die attached Machine
Dust Proof Control
(6) QA Inspection Facilities
AI Vision Machine For Appearance Check
AOI machine
Precision Optical 2D Dimension Inspector
3D SPI (Solder Paste Inspection System)
ICT (In Circuit Tester)
(7) Automatic Screwing and Soldering
(8) Epoxy/Conformal Coating/Drying Facilities
Automatic Conformal Coating Machine
Automatic Epoxy Potting Machine
Heat Oven
UV Cure Oven
(9) Other Production Facilities
Automatic Insertion Machine
Ultra_sonic Cleaning Machine
Wave soldering Machine
Blister packaging Machine
Ultra_sonic Welding Machine
Laser QR code Printer
(10) Burn In Room
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